This role is enabling next generation analysis and characterizations of thin-film lithium niobate (TFLN) structures, photonic integrated circuits (PICs) and modules operating in the GHz regime. System-on-chip measurements and electrooptical characterizations for photonic-modules enable the development, integration and verification of essential building blocks for our core products and demos. This role is combined with responsibilities for PIC labs.

Key responsibilities:

• Deliver high-precision performance data enabling design validation, root cause analysis, and manufacturing yield improvement.
• Shorten design-to-validation cycle time through efficient setup automation and streamlined test methodologies.
• Enhance product performance and manufacturability by providing clear, data-driven recommendations to design and process teams.